Senior Hardware IC Packaging Engineer
A company is looking for a Senior Hardware IC Packaging Design Engineer. Key Responsibilities Drive early chip-package co-design and development of bump and ball map Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging) Required Qualifications Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD Minimum 4+ years of experience in packaging design and layout, preferably in an advanced silicon node Proven track record with multiple packaging types where products have gone to volume production Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals Knowledge of organic laminate substrate technologies and manufacturing capabilities
A company is looking for a Senior Hardware IC Packaging Design Engineer.
Key Responsibilities
Drive early chip-package co-design and development of bump and ball map
Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN
Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging)
Required Qualifications
Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD
Minimum 4+ years of experience in packaging design and layout, preferably in an advanced silicon node
Proven track record with multiple packaging types where products have gone to volume production
Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals
Knowledge of organic laminate substrate technologies and manufacturing capabilities
