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Principal Packaging Engineer
A company is looking for a Principal Packaging Engineer to develop and refine Chip-on-Wafer-on-Substrate technology. Key Responsibilities Innovate and enhance CoWoS packaging processes to improve chip performance, power efficiency, and reliability Collaborate with design, test, and manufacturing teams for seamless chip-package integration Lead failure analysis and drive yield improvements across packaging processes Required Qualifications 15 years of hands-on experience in advanced semiconductor packaging and interconnect processes Proven expertise in CoWoS / FOCoS, with familiarity in EMIB, InFO, and advanced 2.5D/3D integration technologies Strong knowledge of thermal management, reliability testing, and signal/power integrity challenges Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field Proficiency in Mandarin and English is preferred
A company is looking for a Principal Packaging Engineer to develop and refine Chip-on-Wafer-on-Substrate technology.
Key Responsibilities
Innovate and enhance CoWoS packaging processes to improve chip performance, power efficiency, and reliability
Collaborate with design, test, and manufacturing teams for seamless chip-package integration
Lead failure analysis and drive yield improvements across packaging processes
Required Qualifications
15 years of hands-on experience in advanced semiconductor packaging and interconnect processes
Proven expertise in CoWoS / FOCoS, with familiarity in EMIB, InFO, and advanced 2.5D/3D integration technologies
Strong knowledge of thermal management, reliability testing, and signal/power integrity challenges
Bachelor's or Master's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
Proficiency in Mandarin and English is preferred
