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Senior Packaging Design Engineer
A company is looking for a Senior Packaging Design Engineer. Key Responsibilities Drive early chip-package co-design and development of bump and ball map Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN Collaborate with multiple cross-functional teams including Chip Design and SI/PI Required Qualifications Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD Minimum 4+ years of experience in packaging design and layout Proven track record with multiple packaging types in volume production Experience routing high-speed, high pin count devices Knowledge of organic laminate substrate technologies and manufacturing capabilities
A company is looking for a Senior Packaging Design Engineer.
Key Responsibilities
Drive early chip-package co-design and development of bump and ball map
Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN
Collaborate with multiple cross-functional teams including Chip Design and SI/PI
Required Qualifications
Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD
Minimum 4+ years of experience in packaging design and layout
Proven track record with multiple packaging types in volume production
Experience routing high-speed, high pin count devices
Knowledge of organic laminate substrate technologies and manufacturing capabilities
